2025-03-28 アメリカ合衆国・ライス大学
Implantable electrocorticography device (left) made using the heat treatment method (Photo courtesy of Margaux Forner); Rice University logo (right) patterned into PEDOT:PSS using a femtosecond laser (Photo courtesy of Siddharth Doshi)
<関連情報>
- https://news.rice.edu/news/2025/chance-discovery-improves-stability-bioelectronic-material-used-medical-implants
- https://advanced.onlinelibrary.wiley.com/doi/full/10.1002/adma.202415827
熱処理によりバイオエレクトロニクス用の水安定性PEDOT:PSS膜を作製 Thermal Processing Creates Water-Stable PEDOT:PSS Films for Bioelectronics
Siddharth Doshi, Margaux O. A. Forner, Pingyu Wang, Salim El Hadwe, Amy T. Jin, Gerwin Dijk, Kenneth Brinson, Juhwan Lim, Antonio Dominguez-Alfaro, Carina Yi Jing Lim …
Advanced Materials Published: 03 March 2025
DOI:https://doi.org/10.1002/adma.202415827
Abstract
Organic mixed ionic-electronic conductors have emerged as a key material for the development of bioelectronic devices due to their soft mechanical properties, biocompatibility, and high volumetric capacitance. In particular, PEDOT:PSS has become a choice material because it is highly conductive, easily processible, and commercially available. However, PEDOT:PSS is dispersible in water, leading to delamination of films when exposed to biological environments. For this reason, chemical cross–linking agents such as (3-glycidyloxypropyl)trimethoxysilane (GOPS) are used to stabilize PEDOT:PSS films in water, but at the cost of decreased electrical performance. Here, it is shown that PEDOT:PSS thin films become water-stable by simply baking at high temperatures (>150 °C) for a short time (≈ 2 min). It is shown that heat-treated PEDOT:PSS films are as stable as their chemically-cross–linked counterparts, with their performance maintained for >20 days both in vitro and in vivo. The heat-treated films eliminate electrically insulating cross–linkers, resulting in a 3× increase in volumetric capacitance. Applying thermal energy using a focused femtosecond laser enables direct patterning of 3D PEDOT:PSS microstructures. The thermal treatment method is compatible with a wide range of substrates and is readily substituted into existing workflows for manufacturing devices, enabling its rapid adoption in the field of bioelectronics.
